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GSTiR TIMO120 thermal imaging module with lens and ribbon connectorGSTiR TIMO120 thermal imaging module with lens and ribbon connector

GSTiR TIMO120

The GSTiR TIMO120 is a miniature uncooled thermal imaging module from Global Sensor Technology, integrating optics, a 120×90 detector and image processing circuitry. It supports embedded thermal imaging and temperature measurement, with two field-of-view configurations, weight ≤2g, a DVP interface and frame-rate-dependent low power consumption.

GSTiRPayloads & thermal cameras
Resolution
120×90
Weight
≤2g
Dimensions
8.5×8.5×9.16 mm (FOV: 50°); 12×10×5.58 mm (FOV: 90°)

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Product overview

The GSTiR TIMO120 from Global Sensor Technology combines an optical lens, a wafer level packaged detector and basic image processing circuitry to produce thermal images and show heat distribution. Its vanadium oxide detector provides 120×90 resolution with 17μm pixels across an 8~14μm spectral range. The module targets integration into smart devices, thermal imagers and mobile terminals where size, weight and cost constrain the design. Embedded integration uses a DVP interface, with software development support for Android, Linux and Windows.

The two field-of-view configurations require different integration space and connections: the 50° version measures 8.5×8.5×9.16 mm with 34 pins, while the 90° version measures 12×10×5.58 mm with 40 pins. Weight is ≤2g. Typical consumption depends on frame rate, falling from 45mW at 25Hz to 10mW at ≤4Hz. Industrial thermography provides automatically shifting measurement ranges with accuracy of the greater of ±2℃ or ±2%; body screening specifies ±0.5℃ accuracy and an accurate range of 28~40℃ within its 20℃~50℃ measurement range.

Cameras & sensors

Specifications

SpecificationValue & conditions
ModelTIMO120
ManufacturerGlobal Sensor Technology (GST)
Product typeMiniature uncooled thermal module
Integrated hardwareOptical lens, 120x90/17μm wafer level package (WLP) detector and basic image processing circuit
Embedded integration interfaceDVP interface for embedded platforms
Integration targetsSmart devices, thermal imagers and mobile terminals constrained by cost, size and weight
Sensitive materialVanadium Oxide
Resolution120×90
Pixel size17μm
Spectral range8~14μm
Field of view50°±1°/ 90°±5°
NETD≤60mK
Frame rate25Hz (Customizable 1~30Hz)Customizable frame rate: 1~30Hz.
Focusing modeFree
Temperature measurement rangeIndustrial Thermography: -20℃~150℃, 100℃~400℃ (Auto Shift); Body Temperature Screening: 20℃~50℃ (Accurate Range: 28~40℃)Industrial thermography: automatic range shift; body temperature screening: accurate range 28~40℃.
Temperature measurement accuracyIndustrial Thermography: Greater of ±2℃ or ±2%; Body Temperature Screening: ±0.5℃Industrial thermography and body temperature screening have separate accuracy specifications.
External interface34PIN (FOV: 50°); 40PIN (FOV: 90°)34PIN for FOV 50°; 40PIN for FOV 90°.
Typical power consumption45mW@25Hz, 16mW@9Hz, 10mW@≤4Hz45mW at 25Hz; 16mW at 9Hz; 10mW at ≤4Hz.
SDK platformsAndroid/ Linux/ Windows
Storage temperature-40℃~85℃Storage.
CertificateRoHS
Dimensions8.5×8.5×9.16 mm (FOV: 50°); 12×10×5.58 mm (FOV: 90°)Dimensions depend on FOV: 50° or 90°.
Weight≤2g

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