Product overview
The Forlinx Embedded OK3519A-C is an embedded development board for camera processing, intelligent imaging and applications including aerial UAV imaging. Its FET3519A-C core module uses a dual-core Cortex-A53 Hi3519AV100 processor running at 1.5GHz, with 2GB DDR4 memory and 8GB eMMC storage. The eight-layer, immersion-gold core module measures 60*40mm and connects through an ultrathin board-to-board connector. Its specified operating requirements are 5V and 0°C to +70°C. The software configuration combines a Forlinx BSP with Linux 4.9.37 and Qt 5.9, including mouse and touchscreen support.
Camera integration combines multiple sensor inputs with H.265/H.264 encoding and decoding, 4K RAW output, panoramic stitching and a fourth-generation HiSilicon ISP. The development board exposes three MIPI CSI interfaces, MIPI DSI and HDMI display outputs, audio, USB, Gigabit Ethernet and serial interfaces. An external mini PCIe module provides a route to 4G connectivity. PCIe shares resources with USB 3.0, which constrains their use together. Core-module input limits are hardware-design or CPU theoretical values. Procurement planning must also account for the recommendation against selecting this product for new projects because of chip procurement lead times.
Specifications
| Specification | Value & conditions |
|---|---|
| Product and application | Forlinx Embedded OK3519A-C development board for IP surveillance cameras, action cameras, panoramic cameras, aerial UAV imaging, facial recognition and 4K encoding/decoding. |
| Core architecture | FET3519A-C core module based on the HiSilicon Hi3519A V100 processor, using a 12nm low-power architecture. |
| Processor | Hi3519AV100; dual-core Cortex-A53; 1.5GHz. |
| Memory and installed storage | 2GB DDR4 RAM; 8GB eMMC storage. |
| Software environment | Forlinx BSP; Linux 4.9.37 + Qt 5.9; mouse and touchscreen operation supported. |
| Physical construction and connection | Eight-layer PCB with immersion-gold finish.FET3519A-C core module. |
| Integration dimensions, power and temperature | 60*40mm; ultrathin board-to-board connector; 5V operating voltage; operating temperature 0°C ~ +70 °C.FET3519A-C core module. |
| Sensor input capacity | 12-lane video input supporting MIPI, sub-LVDS, HiSPI and SLVS-EC; up to 5 sensor inputs; maximum input resolution 7680x4320.FET3519A-C core-module hardware design or CPU theoretical values. |
| Video encoding, decoding and RAW output | H.265/H.264 encoding and decoding up to 4K*2K@60fps or 1080p@240fps; 4K RAW output. |
| Panoramic stitching | 3840 x 2160@30fps panoramic output in either specified input configuration.Two 3000 x 3000@30fps inputs or four 1080 x 1920@30fps inputs. |
| Image processing and inference | Programmable neural-network inference engine supporting deep-learning algorithms for facial recognition/detection, object detection and gesture recognition; IVE OpenCV hardware acceleration. |
| Image signal processor | Fourth-generation HiSilicon ISP with WDR, multistage noise reduction, six-axis stabilization, image enhancement and correction, and time-multiplexed processing of multiple sensor inputs. |
| MIPI DSI | 1 interface; 4 data lanes; maximum 1080p@60fps.OK3519A-C development board. |
| HDMI | 1 HDMI 2.0 interface; 4K*2K (4096X2160)@60fps.OK3519A-C development board. |
| MIPI CSI | 3 interfaces: one 4-lane, one 2-lane and one 8-lane; OV5640 supported.OK3519A-C development board. |
| Audio | 1 audio interface group; 2 microphone connections and 1 headphone connection.OK3519A-C development board. |
| USB | 3 USB 2.0 Type-A receptacles; 1 USB 3.0 Type-A receptacle.OK3519A-C development board. |
| PCIe | 1 single-lane PCIe interface.OK3519A-C development board; PCIe multiplexed with USB 3.0. |
| Ethernet | 1 RJ-45 interface; auto-negotiating 10/100/1000Mbps Ethernet.OK3519A-C development board. |
| 4G expansion | 1 expansion connection supporting an external mini PCIe 4G module.External mini PCIe 4G module. |
| SD card | 1 SD card interface for programming and data storage.OK3519A-C development board. |
| SDIO | 1 four-bit digital interface; 3.3V levels; 20-pin socket with 2.0mm pitch.OK3519A-C development board. |
| SPI | 1 SPI interface supporting serial master and slave modes; 10-pin socket with 2.0mm pitch.OK3519A-C development board. |
| PWM | 1 PWM interface for LCD backlight adjustment.OK3519A-C development board. |
| IIC | 5 IIC interfaces; fast-mode data rate 400kbit/s.OK3519A-C development board. |
| RS485 | 2 RS485 channels with power and signal isolation; green terminals with 2.54mm pitch.OK3519A-C development board. |
| Real-time clock | 1 external RX8010SJ RTC.OK3519A-C development board. |
| UART | 2 three-wire serial interfaces; 3.3V levels; 10-pin sockets with 2.0mm pitch.OK3519A-C development board. |
| Debug connections | 1 UART0 debug interface with RS232 levels and DB9 male connector; default baud rate 115200. 1 JTAG interface.OK3519A-C development board. |
| Selection limitation | Not recommended for new-project selection because of chip procurement lead times and related factors.New-project component selection. |
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