SS007N04CS

Product overview

SS007N04CS is a MOS semiconductor component from Shenzhen SKY Semiconductor Limited, presented within its LFPAK5x6 package offering described as 40V–100V. It measures 6 mm × 5 mm × 1 mm and uses silicon, epoxy resin and copper. Its copper clip construction eliminates wire bonding, while the package features flexible pins, low parasitic inductance, low thermal resistance and very low internal package resistance. The packaging supports optical inspection and is described as compatible with DFN5×6.

The component’s intended applications include drones, DC brushless motors, robots, communications equipment, servers and industrial power supplies. The 40V–100V description applies to the package offering and should not be treated as a confirmed voltage rating for SS007N04CS. Its maker is headquartered in Shenzhen’s Nanshan High-Tech Industrial Park, with research and development centers in Chongqing and Shanghai. Shenzhen SKY Semiconductor Limited develops, produces and sells semiconductor components across Trench MOS, SGT MOS, IGBT, SiC/GaN and Super Junction product families.

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