Product overview
The Shenzhen Haike Technology Co., Ltd. BLS 2130 55A 4IN1 ESC combines electronic speed control in a four-in-one board format. Its 38.5 × 41mm footprint, 30.5mm-30.5mm mounting-hole specification and 12.5g net weight define the principal physical integration requirements. Construction uses Japanese MOS components, an FD6288Q three-in-one IC drive and a Murata capacitor. The six-layer PCB incorporates 3-ounce copper, resin-plugged holes and edge-metallized solder pads intended to help prevent pad detachment during use.
Electrical integration requires a 2S-6S LiPo input, with specified continuous current of 55A and peak current of 60A. The firmware designation is G_ H_ 30- Rev. 16.7- Multi, and supported control protocols are PWM, Oneshot125, Oneshot42, Multispot, Dshot150, Dshot300 and Dshot600. The galvanometer ratio is 160. For packaging and handling, the specified package measures 64 × 64 × 35mm, with a packaging weight of 51.5g; the ESC itself has a net weight of 12.5g.
Specifications
| Specification | Value & conditions |
|---|---|
| Model | BLS 2130 55A 4IN1 ESC |
| Board size and mounting | 38.5 * 41mm (30.5mm-30.5mm mounting hole) |
| Packaging size | 64 * 64 * 35mm |
| Product net weight | 12.5g |
| Packaging weight | 51.5g |
| ESC firmware | G_ H_ 30- Rev. 16.7- Multi |
| Supported protocols | PWM, Oneshot125, Oneshot42, Multispot, Dshot150, Dshot300, Dshot600 |
| Input voltage | 2S-6S Lipo |
| Galvanometer ratio | 160 |
| Continuous current | 55A |
| Peak current | 60A |
| Power and drive components | Japanese MOS components, three-in-one FD6288Q IC drive, and Murata capacitor |
| PCB construction | Resin-plugged PCB holes, edge-metallized solder pads, 3-ounce copper, and six-layer board |
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